February 2024 — Post-holiday Recovery Kick-off, Focusing on Inductors/Sensors/Interface Materials

    2月，车芯原厂财报集中公布，英飞凌、安森美、NXP、瑞萨在2023年的营收与利润增长普遍放缓，且2024年的需求形势预计会形成更大挑战。

    In February, core automotive chip manufacturers released their financial reports in concentration, with Infineon, ON Semiconductor, NXP, and Renesas experiencing a general slowdown in revenue and profit growth for the year 2023, and the demand outlook for 2024 is anticipated to present even greater challenges.

    行业动态方面，2月1日，英飞凌宣布与本田就功率器件、ADAS等领域建立合作；Qorvo公布运营亏损0.42亿美元，并宣布将收购无线芯片供应商Anokiwave；Microchip公布营收利润均同比大跌，其制造厂会在Q1和Q2分别执行停工。2日，报道传出三星3nm GAA工艺试产良率为零。5日，报道传出力积电将联手日本新创PowerSpin以12英寸产线生产MRAM。6日，集邦咨询TrendForce报告指出大尺寸面板迎涨价。8日，报道传出EDA巨头新思科技拟出售价值超30亿美元的软件完整性业务部门。15日，瑞萨宣布将以91亿澳元收购PCB设计软件厂商Altium。17日，报道传出英伟达AI GPU交期缩短至3-4个月；铠侠提出为SK海力士生产NAND闪存，已恢复与西部数据合并的谈判。19日，报道传出美国晶圆代工厂格芯将获“芯片法案”提供的15亿美元补贴。20日，报道传出台积电现有制程产能利用率全面回升，且2纳米进度优于预期；汽车T1大厂佛瑞亚宣布五年内裁员1万人。21日，报道传出三星平泽P5厂暂停建设，以应半导体需求下降。22日，封测大厂日月光控股宣布收购英飞凌两座后段封测厂。23日，英特尔证实下一代CPU交由台积电以3纳米工艺生产；ADI宣布将借助台积电日本熊本厂JASM生产芯片。24日，台积电熊本厂JASM正式开幕，引入多个成熟制程节点，年底正式量产。26日，美光宣布开始量产HBM3E产品，领先两大韩厂。27日，业内传出德州仪器裁撤国内电源芯片设计团队。28日，英飞凌宣布重组销售架构，分为“汽车”、“工业与基础设施”与“消费、计算与通讯”三部分；美国法院裁定福建晋华无罪；苹果宣布取消电动车项目，全力转向生成式AI。29日，英特尔宣布独立后的FPGA公司恢复为Altera名称并将上市；力积电宣布将协助塔塔集团建设印度首座12英寸晶圆厂。

  In industry dynamics, on February 1st, Infineon announced a collaboration with Honda in the fields of power devices and ADAS; Qorvo reported an operational loss of $42 million and announced its intention to acquire wireless chip supplier Anokiwave; Microchip disclosed a significant year-over-year drop in both revenue and profits, with the company planning shutdowns at its manufacturing plants for Q1 and Q2. On the 2nd, it was reported that Samsung's 3nm GAA process trial production had a yield rate of zero. On the 5th, it was reported that TSMC would collaborate with the Japanese startup PowerSpin to produce MRAM on a 12-inch line. On the 6th, TrendForce from Topology Research Institute noted that large-size panels are facing a price increase. On the 8th, it was reported that EDA giant Synopsys is planning to sell its software integrity business unit valued at over $3 billion. On the 15th, Renesas announced its intention to acquire PCB design software company Altium for 9.1 billion Australian dollars. On the 17th, it was reported that NVIDIA's AI GPU delivery times have been shortened to 3-4 months; Kioxia proposed to produce NAND flash for SK hynix, resuming merger talks with Western Digital. On the 19th, it was reported that U.S. foundry GlobalFoundries would receive a $1.5 billion subsidy from the "CHIPS Act." On the 20th, it was reported that TSMC's existing process capacity utilization has fully rebounded, and the progress of the 2nm process is better than expected; automotive T1 manufacturer Valeo announced a plan to cut 10,000 jobs over the next five years. On the 21st, it was reported that Samsung's Pyeongtaek P5 plant has temporarily halted construction to adjust to a decline in semiconductor demand. On the 22nd, packaging and testing giant ASE Technology Holding announced the acquisition of two back-end packaging plants from Infineon. On the 23rd, Intel confirmed that its next-generation CPU would be manufactured by TSMC using the 3nm process; ADI announced that it will utilize TSMC's Kumamoto plant JASM in Japan for chip production.  On the 24th, TSMC's Kumamoto plant JASM was officially inaugurated, introducing multiple mature process nodes, with official mass production expected by the end of the year. On the 26th, Micron announced the start of mass production of HBM3E products, leading the two major Korean manufacturers. On the 27th, industry rumors circulated that Texas Instruments has dismantled its domestic power chip design team. On the 28th, Infineon announced a restructuring of its sales structure into three divisions: "Automotive," "Industrial & Infrastructure," and "Consumer, Computing & Communications," a U.S. court ruled Fujian Jinhua not guilty; Apple announced the cancellation of its electric vehicle project, focusing entirely on generative AI. On the 29th, Intel announced that the independent FPGA company will revert to the name Altera and will go public; TSMC announced that it will assist the Tata Group in establishing India's first 12-inch wafer plant.

2月经历了春节假期，热搜TOP 10中两大核心STM32物料的搜索量均有明显下降，但近期备受瞩目的村田共模扼流圈DLW5B的热度得以延续，表明原厂因地震停产的影响仍在。高价以太网芯片KSZ8999I的搜索量没有因春节因素而降低，表明其热度实质上增长。与之对比，美信收发器MAX13487EESA在节后的热度回弹较低，单月总搜索量也大幅下降。春节假期过后，TI的TMS320F28335PGFA、Microchip的ATMEGA2560-16AU以及美信的恒温器DS18B20+有着较强的热度提升，超越以往单周均值。此外，赛灵思FPGA配置存储器XCF32PFSG48C作为长期以来的高价物料，热度也有强力回弹，代表其仍处于供不应求的态势。

February experienced the Spring Festival holiday, and there was a noticeable decline in the search volume for the two core STM32 materials in the hot search TOP 10. However, the Murata common mode choke DLW5B, which has recently been in the spotlight, continued to maintain its popularity, indicating that the impact of the factory's production halt due to the earthquake is still present. The search volume for the high-priced Ethernet chip KSZ8999I did not decrease due to the Spring Festival, suggesting that its popularity has, in fact, increased. In contrast, the post-holiday rebound in popularity for Maxim's transceiver MAX13487EESA was lower, and the total monthly search volume also significantly decreased. After the Spring Festival holiday, there was a stronger increase in interest for TI's TMS320F28335PGFA, Microchip's ATMEGA2560-16AU, and Maxim's thermostat DS18B20, exceeding their usual weekly averages. Additionally, the Xilinx FPGA configuration memory XCF32PFSG48C, a long-term high-priced material, also experienced a strong revival in popularity, indicating that it still faces a situation where demand outstrips supply.

库存波动TOP 10：村田电感需求延续，其余热点各异

2月库存波动TOP 10中，村田LQH和DLW电感类物料仍在榜单内，反映其备货需求延续。其余部分，从节后库存量与搜索量、价格的联动变化可以看出，部分传感和信号链类物料需求回升，反映市场回暖态势。至于需求是否能够延续，要看未来宏观环境变化是否能够激发更多备货需求。

  Inventory Fluctuation TOP 10: Murata inductors demand persists, other hotspots vary

  In the Inventory Fluctuation TOP 10 for February, Murata's LQH and DLW series inductors remain on the list, indicating the continuation of stockpiling demand for these components. For the rest, post-holiday variations in inventory levels, search volume, and prices suggest a rebound in demand for certain sensors and signal chain materials, reflecting a warming market trend. Whether this demand can be sustained will depend on whether future macroeconomic changes can stimulate more stockpiling demand.

IC需求与供应

2月，TI、ST、ADI、NXP、英飞凌、Microchip等主要品牌物料的需求仍有待恢复，原厂交期持续改善，市场现货多，且基于去库存阶段的主基调，现货与排单价格倒挂的现象仍在呈现。ADI对成熟产品的涨价，目前看对市场影响较小，但该原厂车芯、工控类物料交期相对较长。安森美工控、车规类物料交期仍较长。被动元件方面，村田电感类物料备货需求延续，LQH与DLW系列物料市场库存普遍被订空，但其他被动类物料没有明显波动。存储方面，韩系原厂及美光加大对HBM、DDR5等高阶品的投入，主流DRAM仍以控量保价为主，反映到需求端则延续涨价；NAND闪存延续之前控制供应的态势，预计涨价也将延续。

  IC Demand and Supply in February

  In February, there is still a wait for demand recovery for main brand materials from TI, ST, ADI, NXP, Infineon, Microchip, etc. Original manufacturers continue to improve delivery times, there is an abundance of spot market inventory, and due to the de-stocking phase being the dominant theme, the phenomenon of spot prices being inverted compared to order prices persists. ADI's price increase for mature products currently seems to have a minimal impact on the market, but this original manufacturer has relatively longer delivery times for automotive and industrial control materials. ON Semiconductor also has extended lead times for industrial control and automotive grade materials. In terms of passive components, the stockpiling demand for Murata inductor materials continues, with LQH and DLW series materials generally running out of stock in the market, but there is no significant fluctuation for other types of passive materials. Regarding memory, Korean original manufacturers and Micron are increasing their investment in high-end products like HBM and DDR5, with mainstream DRAM still primarily managed by volume control to maintain prices, which is reflected on the demand side by continuing price increases; NAND flash memory continues the previous approach of supply control, and price increases are expected to continue.