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Coil on Module

The innovative dual-interface chip packaging technology  for secured smart card solutions

The innovative Coil on Module (CoM) packaging technology from Infineon  is widely used for security applications like payment and identity (ID) and  uses a radio frequency link instead of the mechanical / electrical connection  typically used between the card antenna and the module. This improves the  robustness and long-term reliability of dual interface (DIF) payment cards as  well as ID documents and simplifies card design, manufacturing, and logistics. The card design process is more efficient and up to five times faster than  with conventional direct connect packaging technologies. Based on our extensive semiconductor and module expertise as well as our  profound understanding of card manufacturers’ systems and requirements,  CoM underlines our technology leadership in this field. CoM design featuring inductive coupling Inductive coupling technology for DIF applications employs two antennas,  one on the module and one on the card inlay. These antennas connect  electromagnetically, functioning in a similar way to the air interface of  contactless cards.

Coil design guide We offer a coil design guide defining parameters for optimized card antenna  layout. We have also evaluated, qualified and pre-certified different antenna  technologies (AL* etched, copper wire, etc …) so that card manufacturers can  easily switch to dual-interface card production using antennas compatible  with our CoM. The migration to new technologies requires no additional  effort, as the antenna design can be reused.

Top benefits of our unique CoM design 

‒ Easy card antenna design: 

       ‒ Available guides including evaluated, qualified,  and pre-certified different antenna formats 

        ‒ Flexibility to freely combine chips, modules, and  card antennas, reuse of card antenna layout  

‒ Reduced complexity and smaller inventory, faster  development cycles and faster time-to-market 

‒ The CoM package is based on the flip chip on substrate  (FCOS*) technology proven through billions of  delivered modules 

‒ Improved ESD behavior at production and in the field 

‒ Highest reliability levels thanks to integrated  antenna and inductive coupling for improved  mechanical robustness 

‒ Antenna centered in card stack to avoid warpage  during card production 

‒ Environment friendly: 

        ‒ Up to 50 % less weight than direct-connect solutions 

        ‒ CoM can be used in combination with recycled  card materials 

        ‒ Less card body waste during milling 

        ‒ No electrical interconnection between module  and card antenna necessary